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iNEMI HDI Socket Warpage Prediction and Characterization Webinar
November 15, 2024 | iNEMIEstimated reading time: 1 minute
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases. With large sockets, dynamic warpage prediction and control during reflow onto the printed circuit board is a significant challenge. Simulation is critical in the product development process, helping designers make the right design choices before significant investment in tooling and industrialization. Socket warpage prediction is now facing a few challenges. The majority of simulation computation is consumed by flow analysis in the pin hole region. An ability to speed up computation is desired to shorten socket design cycle. At the same time, accuracy of the simulation needs to be retained at an acceptable level.
Phase 1 of the High Density Interconnect Socket Warpage Prediction and Characterization Project investigated the impact of socket design, fiber-filled material properties and molding process conditions on socket warpage. Results showed computational time could be reduced for the flow part of simulation with reasonable accuracy.
Phase 2 of the project continued the work of improving socket warpage simulation accuracy and further investigated the impact of molding materials and design on warpage for large sockets. The team found that standard composite model assumptions for socket warpage may under- or over-predict warpage. This was because the standard composite model adopted a polymer matrix assuming the material was homogeneous, but it did not consider the effect of fillers. Thus, the project team investigated a new Mori-Tanaka mechanics model as it has the capabilities to incorporate both the polymer matrix and the anisotropic effect of fillers.
This end-of-project webinar will report the results and lessons learned from Phase 2 of the High-Density Interconnect Socket Warpage Prediction and Characterization Project.
Registration
Two sessions are scheduled (with the same content) and are open to the public; advance registration is required. If you have any questions or need any additional information, please contact Haley Fu (haley.fu@inemi.org).
Session 1
Thursday, December 5, 2024
7:30-8:30 a.m. EST (US)
1:30-2:30 p.m. CET (Europe)
8:30-9:30 p.m. CST (China)
Register for Session 1
Session 2
Friday, December 6, 2024
8:00-9:00 a.m. CST (China)
7:00-8:00 p.m. EST (US) on December 5
Register for Session 2
Suggested Items
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating
05/29/2024 | Neil Hubble, AkrometrixMoisture sensitivity requirements for non-hermetic surface mount devices are defined in the joint IPC/JEDEC standard J-STD-020E, “Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Non-hermetic Surface-Mount Devices,” last updated in December 2014. This standard allows customers and suppliers to place electronics devices into specific categories, defined into 8 different moisture sensitivity levels (MSL). Test method criteria are defined within this standard to define MSL levels for different packages. A subsection of MSLs are shown in Figure 1 below, showing the MSL 3 and 4 used in this study.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Indium’s Wisdom Qu to Present at SMTA China South Technical Conference
09/29/2023 | Indium CorporationIndium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
SHENMAO's New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues
03/13/2023 | SHENMAO America, Inc.SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.