SIA Commends Finalization of CHIPS Incentives for TSMC
November 18, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.
“We commend the U.S. Department of Commerce and TSMC for working diligently to finalize this agreement, which will expand crucial advanced manufacturing capacity here at home and help promote U.S. leadership in the game-changing technologies of the future. This agreement will strengthen America’s economic and national security, while also creating thousands of construction and manufacturing jobs. We welcome the progress being made to move forward CHIPS incentives and reinforce U.S.-based semiconductor production and innovation. And we look forward to continuing to work with leaders in industry and government to ensure the CHIPS Act delivers maximum benefits for American manufacturing and innovation.”
The Commerce Department previously announced preliminary incentives agreements for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
Suggested Items
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Tata Electronics Appoints KC Ang as President and Head of Tata Semiconductor Manufacturing
04/03/2025 | PRNewswireTata Electronics Private Limited, a pioneer in the Indian electronics and semiconductor manufacturing sector, announced the appointment of KC Ang as President and Head of its Foundry business - Tata Semiconductor Manufacturing Private Limited reporting to Dr. Randhir Thakur, CEO & MD of Tata Electronics.
UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony
04/01/2025 | BUSINESS WIREUnited Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony.
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
03/31/2025 | PRNewswireThe growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.