Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
September 11, 2025 | ManncorpEstimated reading time: 1 minute

Secure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp. This investment will significantly enhance SSM’s manufacturing capabilities, allowing them to provide scalable, cost-effective, and secure U.S.-made technology to the aerospace, defense, and energy sectors, as well as to startups and commercial enterprises.
The new SMT line features a range of state-of-the-art equipment, including an AP435 automatic stencil printer, an MC388HS 8-head pick and place machine, a CR5000 reflow oven, an inline 500LA AOI, an MX1 X-Ray machine, a Trident LDO stencil clear, and a NEO-L selective solder machine. The purchase also includes all the necessary board handling equipment to make the SMT line a full touch-free operation. This comprehensive suite of tools will enable Secure Semiconductor Manufacturing to deliver high-quality, reliable, and secure electronics manufacturing services.
“Manncorp’s sales team was extremely knowledgeable and helped us select the best equipment for the flexibility in contract manufacturing,” said Bart Massey, President of Secure Semiconductor Manufacturing. “Chris Ellis not only helped us determine the right equipment, he even helped lay out the factory floor for the most efficient operation.”
Massey also praised Manncorp’s post-sales support: “Manncorp’s service has been awesome in helping us get the operation running smoothly. They are extremely knowledgeable and always available to assist. Eric Bach, in particular, has been a great asset, remoting in and solving any programming issues immediately.”
This acquisition represents a significant step forward for Secure Semiconductor Manufacturing in its mission to strengthen America’s technological independence. In a further move to bolster domestic supply chains, SSM is also rolling out a bare board manufacturing line, slated to be operational by the end of 2025.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Technica Hosts in House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.
Jabil Posts Q4 and Fiscal Year 2025 Results
10/01/2025 | JabilJabil Inc., reported preliminary, unaudited financial results for its fourth quarter and fiscal year ended August 31, 2025.
Incap Slovakia Integrates ERP and MES Systems to Accelerate Operations
09/30/2025 | IncapIncap Slovakia, part of the global EMS provider Incap Corporation, has implemented SAP Business One (SAP B1) to strengthen operational control, improve traceability, and support faster, more flexible manufacturing.
Samsung Cuts 2nm Wafer Prices to Undercut TSMC
09/30/2025 | I-Connect007 Editorial TeamSamsung Electronics has lowered the price of its 2-nanometer wafers to approximately $20,000, undercutting rival Taiwan Semiconductor Manufacturing Co. (TSMC) by about one-third, Digitimes reported on September 29.
QuantumScape, Corning Announce Agreement for Ceramic Separator Development & Commercialization
09/30/2025 | BUSINESS WIREQuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Corning Incorporated, one of the world’s leading innovators in glass, ceramics, and materials science, announced an agreement to jointly develop ceramic separator manufacturing capabilities for QS solid-state batteries.