-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Introduces First Standard for In-Mold Electronics
November 18, 2024 | IPCEstimated reading time: 1 minute
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
IPC-8401 is the first of what is expected to be a series of standards that will move beyond the automotive industry and cover IME for smart home products and aviation.
The standard was developed by the D-83A In-Mold Electronics Interconnection Task Group, a group comprised of experts worldwide, led by Paavo Niskala from TactoTek and Iker Arroyo Moso from Eurecat. Niskala says, “The automotive industry has driven the development of IME because it significantly reduces the cost, weight, waste, and energy required to produce vehicle interior parts. Rather than using a PCB in a plastic molding with features interacting with PCB sensors, IME components are integrated directly into the plastic molding, making the manufacturing process more streamlined, sustainable, and efficient.
Key guidelines covered in IPC-8401 include:
- Manufacturing Processes: Introduction to the manufacturing processes involved in producing in-mold electronics.
- IME Part Structure: This defines a standardized IME part structure supporting the design and processing of IME parts for mass production.
- Candidate Materials: Provides material selection criteria and recommendations as industry-adopted practices, covering all materials, including substrates, functional inks, SMT components, SMT adhesives, and injection molding resins.
- Production Test Methods: Defines best practices and criteria for process controls-driven testing throughout the manufacturing processes.
To purchase IPC-8401, visit the IPC Store. To participate in IPC standards development committee meetings like the D-83A In-Mold Electronics Interconnection Task Group, visit the IPC’s committee page.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.
Winners of Hand Soldering and Wire Harness Competitions Announced at NEPCON Vietnam 2025
09/24/2025 | Global Electronics AssociationIn conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.
Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
09/22/2025 | Global Electronics AssociationThe Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more.
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.