Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
November 19, 2024 | Nano DimensionEstimated reading time: 2 minutes
Nano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
Designed using insights gathered from users of Nano Dimension’s proven and established Fabrica Tera and Fabrica Giga systems, the Exa 250vx has been engineered to deliver the highest productivity in the industry for exceptionally precise micro parts. Built to support the demands of service bureaus and OEMs alike, the Exa 250vx Micro 3D printer provides a reliable and cost-effective alternative to traditional micro-manufacturing methods, including micro-injection molding and micro-CNC.
Leveraging resin-based DLP technology to achieve precise layer heights and exceptional surface finishes, the Exa is an ideal solution to meet the exacting needs of manufacturers across an array of vertical sectors and applications. These include connectors and other miniaturized components for electronic devices; medical devices like micro needles, micro filters, and components for minimally invasive surgeries; plus applications for optical uses and micro-decorative items - including gold coated - for the jewelry sector.
Further benefits are assured due to Exa’s compatibility with Nano Dimension’s range of resins for high resolution micro parts , starting with D-810 . This enables the production of durable, rigid parts with high structural integrity – perfect for creating intricate and precise components in the aforementioned application areas. As with the other Fabrica systems, there is an open system policy, allowing users to work with third party resins.
“Manufacturers producing micro parts are facing a trade-off between precision and productivity,” says Nir Sade, Senior Vice President of Additive Manufacturing at Nano Dimension. “As part of Exa’s development, we worked closely with customers to address a host of needs such as high-volume parts production with micro level detail for parts larger than the 50mm build limit we currently have on the Tera. The result is a system that provides the perfect balance of quality, productivity and cost, making it a game changer for the industry.”
With its larger 100mm x 100mm x 70mm build volume, 7.6µm XY resolution, and layer thickness of just 10 microns, the Exa combines sought after attributes that deliver rapid production and high resolution, allowing manufacturers to produce the specific micro parts to meet their particular engineering requirements.
Available now for pre-order, the Exa is set to ship in Q2 2025.
Suggested Items
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection
06/03/2025 | INSPECTISThe Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’.
DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot
06/03/2025 | TrendForceTrendForce’s latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes.
Micro LED Expands Beyond Displays, Unlocking New Opportunities in Transparent and Non-Display Applications
05/30/2025 | TrendForceTrendForce forecasts that the chip market value for Micro LED display applications will reach US$740 million by 2029, with a CAGR of 93% from 2024 to 2029.
Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment
05/30/2025 | MicrosemblyMicrosembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.