Standard of Excellence: The Power of Personalization in Customer Care
Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
Advanced Packaging: Preparation is Now
November 20, 2024 | Nolan Johnson, SMT007 MagazineEstimated reading time: 2 minutes
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Nolan Johnson: Your white paper on advanced packaging is a very technically deep, insightful piece with great detail. What's the ultimate goal?
Matt Kelly: Our intent was to go one layer deeper into our silicon-to-systems messaging. You've heard this phrase as a way to describe what's happening at the front end of the supply chain, from chips to the final system. The report begins by talking about applications. It's important to understand that advanced packaging is very broad, so we break down what it means to drive market segments.
For example, advanced packaging means different things in different applications, such as high-performance computing (HPC), 5G/6G wireless communications, autonomous driving and EV automotive, medical electronics, and aerospace and defense systems. Depending on the type of environment and product you're dealing with, the challenges, needs, and requirements for what these advanced packaging techniques can deliver will vary.
This report is important because it combines two concepts—component-level packaging (CLP) and system-level packaging (SLP)—which are obviously related.
It’s important to convey that the amount of time, effort, and investment IPC has made to stay on top of changes with advanced packaging will be ongoing and is here to stay. A long time ago, someone taught me that “everything follows silicon”; just watch what it does, and everything else will follow. That lesson holds true here, too. People are already doing a lot of this work. Products and devices are using this technology as we speak. This is not “someday”; it's actually happening now. But as with everything else, there's breadth to this for the entities unaware of these challenges. We know it’s important for our membership and the industry that we stay on top of this.
To read the continue reading this article, which originally appeared in the November 2024 SMT007 Magazine, click here.
Share on:
Suggested Items
KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025
02/21/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 3-6 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ.
Siemens Delivers Certified and Automated Design Flows for TSMC 3DFabric Technologies
02/17/2025 | SiemensSiemens Digital Industries Software announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens industry-leading advanced packaging integration solutions.
LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement
02/11/2025 | LQDXLQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.
3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.
02/04/2025 | PR Newswire3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.