-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ESCATEC Appoints Steven Waterston to Lead Mechatronics Sales
November 20, 2024 | ESCATECEstimated reading time: 1 minute
Growth-focused, electronics manufacturing services (EMS) provider, ESCATEC, has appointed industry veteran Steven Waterston as a Director of Business Development, effective immediately. He will lead ESCATEC’s initiatives to secure new mechatronics projects globally, by leveraging on the Group’s expertise and technical capabilities in meeting the needs of OEMs in this market segment.
Waterston brings 24 years of experience in the EMS industry and 14 years in semiconductor manufacturing, and was recently Senior Director of Business Development at Flex within their Industrial Business Unit focused on capital equipment manufacturing. He has a strong reputation for driving sales growth and building successful cross-border sales teams, with extensive experience in contract and financial negotiations.
“We are delighted to have Steven join us,” said ESCATEC CEO Charles-Alexandre Albin, “his expertise will enable ESCATEC to deliver increasingly complex projects and to strengthen partnerships with OEMs who require high-performance and cost-efficient mechatronics solutions.”
Waterston’s appointment underscores ESCATEC’s commitment to investing in exceptional talent and supporting OEMs with innovative and scalable solutions that drive market success.
ESCATEC offers a full value chain of EMS services, from D&D to product certification to mass manufacturing and after-sales services, ranging across electronics, mechatronics, machining, MOEMS, box build, and plastic moulding. The Group’s integrated production network encompasses four facilities in Malaysia, two at Chomutov in the Czech Republic, one in Lutterworth in the United Kingdom, one at Plovdiv in Bulgaria, and an advanced microelectronics facility in Heerbrugg, Switzerland. It also has a Design & Development (D&D) Centre in Switzerland and strategic partnerships in Croatia and the United States.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.