Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
November 22, 2024 | Dan Feinberg, I-Connect007Estimated reading time: 1 minute
In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Patty first got involved with IPC in 1981 when she volunteered to chair the Process Effects Subcommittee. She did this for many years, corralling volunteers from every facet of PCB manufacturing to work on various sections of the Troubleshooting Guide for Printed Circuit Manufacturing and Assembly through its second and third editions. At one point, due to an overload of work at IPC, she even took on the task of doing the typesetting so it could get published. Along the way, she received IPC’s President Award, became chair of the committee over the Professional Education (PE) subcommittee, and was a member of the Technical Activities Executive Committee (TAEC). She also served a two-year tenure as chair of the TAEC, considered a top volunteer position at IPC. Later, when the glass reinforcement subcommittee/task group had a stalled round-robin testing program, Patty was asked to chair the group to get it moving. One of Patty’s many significant contributions was reducing the length of the normally drawn-out TAEC meetings in half by using a focused agenda.
Patty has been a significant contributor to I-Connect007. She is the former managing editor of PCB007 Magazine and has offered her talents and expertise for many years, providing excellent show coverage through her interviews and special event write-ups at IPC APEX EXPO. You may not always agree with her viewpoint, but you can bet that you will respect, and often ask for, her opinion.
Patty received the IPC Raymond E. Pritchard Hall of Fame Award in 2015.
If you are an IPC Hall of Fame member, please help me complete this series by sending your present contact information to baer@feinline.com.
This article originally appeared in the November 2024 issue of PCB007 Magazine.
Share on:
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
IPC-CFX, 2.0: How to Use the QPL Effectively
07/02/2025 | Chris Jorgensen, Global Electronics AssociationIn part one of this series, we discussed the new features in CFX Version 2.0 and their implications for improved inter-machine communication. But what about bringing this new functionality to the shop floor? The IPC-CFX-2591 QPL is a powerful technical resource for manufacturers seeking CFX-enabled equipment. The Qualified Product List (QPL) helps streamline equipment selection by listing models verified for CFX compliance through a robust third-party virtual qualification process.
Advancing Aerospace Excellence: Emerald’s Medford Team Earns Space Addendum Certification
06/30/2025 | Emerald TechnologiesWe’re thrilled to announce a major achievement from our Medford, Oregon facility. Andy Abrigo has officially earned her credentials as a Certified IPC Trainer (CIT) under the IPC J-STD-001 Space Addendum, the leading industry standard for space and military-grade electronics manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.