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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
November 26, 2024 | Yusaku Kono, IPC Japan RepresentativeEstimated reading time: 2 minutes
In the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Economic Recovery and Inflation Challenges in Japan
After the pandemic ended, Japan saw a moderate economic recovery in 2023 and 2024. GDP growth has remained positive, driven by increased consumer spending and exports. However, rising energy and food prices, along with a weaker yen and stronger dollar, have led to higher living costs. In response, the Bank of Japan, anticipating that it could sustainably achieve its 2% price stability target, raised the zero interest rate for the first time in 17 years and introduced anti-inflationary measures, including an increase in interest rates.
The labor market is facing challenges, particularly in securing human resources in the service and manufacturing sectors, while upward pressure on wages is impacting business operations. Despite these issues, exports are recovering, especially to Asian markets.
While in Japan, IPC President and CEO John W. Mitchell, along with other IPC executives, met with leaders from Panasonic Holdings (Mr. Tsuga) and NEC (Mr. Endo) to discuss global electronics trends and international standardization. They also engaged with the Ministry of Economy, Trade and Industry (METI) and Keidanren (Japan Business Federation) to exchange views on advanced packaging and semiconductor strategies. Mitchell was invited to speak at Keidanren's "Pioneering the Global Market: Top International Standards Strategy Seminar for Executives," which was attended by more than 200 participants. “The lively and thought-provoking discussion was very informative,” said Keidanren’s Takimoto.
Growing Influence in Japan's Electronics Industry
The electronics industry plays a significant role in Japan’s economy, and the landscape for IPC in Japan has changed dramatically in recent years. Many Japanese companies that previously adhered to their own standards are now widely recognizing and adopting IPC standards to improve quality control and manufacturing processes. A notable development is Toyota Motor Corporation’s adoption of IPC standards, which led to the issuance of the Automotive Addendum to J-STD-001/IPC-A-610 in 2021, establishing IPC-based solder appearance standards. The J-STD-001/IPC-A-610 Automotive Addendum Japan Regional Task Group (7-31BV-JP) was established in 2022 to encourage Japanese suppliers and companies to contribute actively to the IPC standards. This task group includes over 30 companies, such as Tokai Rika Co. A face-to-face meeting was held at Toyota Motor Corporation's Nagoya office in August 2024 to discuss proposed improvements to the standards.
Continue reading this article in the Fall 2024 issue of IPC Community.
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02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
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Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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