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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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CIMS to Showcase Advanced Solutions at HKPCA 2024
November 29, 2024 | CIMSEstimated reading time: Less than a minute
CIMS, a leader in inspection solutions for the electronics manufacturing industry, will participate in the Hong Kong Printed Circuit Association (HKPCA) Show 2024. The event will take place in Shenzhen, China, from December 4th to 6th, offering a platform for CIMS to highlight its cutting-edge technologies.
Attendees are invited to visit CIMS at booth 5D01, where the company will present its latest innovations. These include Spark™ 4.0, a powerful software inspection engine designed to enhance accuracy and efficiency. CIMS will also showcase advanced inspection solutions tailored for IC substrates, Ucamco's next-generation pre-CAM and full CAM software, and advanced material handling automation solutions that cater to all PCB industry segments.
CIMS is dedicated to driving progress in the electronics manufacturing sector, and this event marks an opportunity to demonstrate its commitment to innovation and excellence.
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CIMS Launches Capricorn, Next Generation AVI Solution
02/23/2022 | CIMSCIMS is launching its next generation AVI solution for IC Substrates based on a brand new platform – Capricorn.