Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
December 2, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Whitepaper Abstract:
Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes. Standard materials like epoxies, adhesives, or solder pastes are most often used in the die attach process. However, it is critical to remove any flux residues left behind after soldering before proceeding with wire bonding and molding to ensure maximum yield in packages that use solder paste for die attachment. One of the most widely used cleaning agents to remove flux residues is isopropyl alcohol (IPA). While IPA is commonly used as a general cleaner in the electronics industry, it is not the most effective solution for flux removal.
Semiconductor package manufacturers produce millions of units daily and therefore, a small improvement in the wire bonding yield can significantly impact production efficiency and the overall product costs.
One such OEM was producing lead frame packages and using IPA (Isopropyl alcohol) in the ultrasonic cleaning process. However, their process resulted in a wire bonding yield of only 98%, measured after the molding and deflashing processes. This indicated significant motivation to improve the cleaning process and the wire bonding yield.
A Design of Experiment (DOE) was developed to assess alternative cleaning agents and process equipment, aiming to optimize the cleaning process and to be evaluated based on the improvement in wire bonding yield. Process qualification was conducted through a pull test according to the MIL-STD-883E method 2011.7. Throughout the DOE process iterations, process improvements were identified through visual inspection, pull and shear testing as well as overall yield measurement from the wire bonding process.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Unlocking the Promise of AI in Electronics Manufacturing
10/29/2025 | Shobhit Agrawal, Keysight TechnologiesThe electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.