Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Confidee Achieves ISO/IEC 27001:2022 Certification: Strengthening Information Security and Compliance
December 4, 2024 | CONFIDEEEstimated reading time: 2 minutes
Confidee, the world´s leading PCB Regulatory Technology company, proudly announces its achievement of the ISO/IEC 27001:2022 certification. This achievement further demonstrates Confidee´s commitment to delivering compliant PCBs according to industry standards and regulations.
We are proud to announce that Confidee has achieved ISO/IEC 27001:2022 certification, underscoring our unwavering commitment to information security and compliance. This milestone reflects our dedication to safeguarding data and delivering compliant PCBs that meet the highest industry standards.
“At Confidee, we recognize the responsibility that comes with our role as a PCB partner. This certification is a testament to our ongoing efforts to empower compliance and build trust with our clients and partners”, says Robert Kurti Chief Information Officer (CIO) at Confidee.
Protecting sensitive customer data, mitigating risks
The ISO/IEC 27001:2022 certification is an internationally recognized standard for information security management systems (ISMS). By achieving this certification, we demonstrate that robust systems and protocols are in place to protect sensitive customer data, mitigate risks, and ensure supply chain integrity.
Confidee ´s proprietary in-house developed IT solution constitutes the reason why Confidee is a PCB Regulatory Technology company. The strategy of developing IT solutions to monitor and control the PCB supply chain for all partners, is hence one of the true differentiators of Confidee versus other market actors. Achieving both ISO/IEC 27001:2022 and AS9120 Aerospace Management System Certification, underscores this commitment.
Integrating compliance, access control, and advanced cybersecurity measures
"Protecting information and controlling access are critical in our rapidly advancing digital world," Kurti says. "This certification validates the importance of our IT platform that seamlessly integrating compliance, access control, and advanced cybersecurity measures."
The ISO/IEC 27001:2022 certification is important in the PCB industry, where the handling of sensitive customer designs and intellectual property is integral to operations. Achieving this standard highlight Confidee´s proactive measures to:
- Protect customer data: Minimize the risk of data breaches and unauthorized access.
- Enhance supply chain security: Safeguard the integrity and traceability of the PCB supply chain.
- Foster industry compliance: Align with evolving regulatory and customer demands for secure and compliant operations.
A leader in compliance within the PCB industry
"Achieving the ISO/IEC 27001:2022 certification is just one of the many steps we are taking to enhance compliance and security for our customers," Kurti concludes. "We are continuously working on projects and focusing on new initiatives that will put our customers at ease regarding information security and supply chain compliance. This certification reinforces our commitment to being a trusted partner and leader in compliance within the PCB industry."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.