If You Can Define It Right, You Can Design It Right
December 5, 2024 | Andy Shaughnessy, Design007Estimated reading time: 1 minute
Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance.
With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.
Andy Shaughnessy: I know that you’ve spent a lot of time and effort over the years dialing in your design process. How do you use rules of thumb in your design cycle?
Chris Young: I use purpose-driven rules of thumb that produce practices that reduce risk and drive a desired outcome. I am much less concerned about using a specific PCB stack-up than producing a solution that works and meets requirements.
Shaughnessy: What are some of the rules of thumb that you use regularly, and why?
Young: Rule No. 1: If you can define it right, you can design it right.
Spend time up front developing requirements that can be used to guide your design to success. The lack of requirements in a project lead to technical ambiguity that is too often stop-gapped with assumptions. These assumptions lead to design errors that result in technical debt or design spins that cost money. The old adage of “measure twice, cut once” still applies. I recommend the INCOSE Guide to Writing Requirements (incose.org) for anyone interested in learning more about developing clear, actionable requirements.
To read this entire conversation, which appeared in the November 2024 issue of Design007 Magazine, click here.
Suggested Items
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.