Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Telecom EMS Sector Embraces Green Manufacturing Practices
December 6, 2024 | Globe NewswireEstimated reading time: 1 minute
The global market for Telecom Electronic Manufacturing Services (EMS) was estimated at US$213.4 Billion in 2023 and is projected to reach US$319.5 Billion by 2030, growing at a CAGR of 5.9% from 2023 to 2030.
What Factors Are Driving the Growth in the Telecom EMS Market?
The growth in the Telecom EMS market is driven by several factors, including increasing demand for telecom infrastructure, rising deployment of 5G networks, and the need for cost-efficient manufacturing solutions. Advancements in EMS technology, such as automation, precision testing, and advanced design capabilities, have supported broader applications in telecom components. The focus on reducing production costs, improving quality assurance, and accelerating time-to-market has further fueled demand, as EMS providers offer specialized expertise in high-volume manufacturing. Additionally, growing investments in network expansion, expanding IoT applications, and increased adoption of fiber optic networks have contributed to market growth, encouraging the use of EMS in the telecom sector.
Key Insights:
- Market Growth: Understand the significant growth trajectory of the Electronic Manufacturing Service segment, which is expected to reach US$127.6 Billion by 2030 with a CAGR of a 6.8%. The Supply Chain Management Service segment is also set to grow at 5.7% CAGR over the analysis period.
- Regional Analysis: Gain insights into the U.S. market, estimated at $58.0 Billion in 2023, and China, forecasted to grow at an impressive 5.6% CAGR to reach $50.0 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).