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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
December 9, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: Less than a minute

The electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
In response to these challenges, two industry leaders—iNEMI (International Electronics Manufacturing Initiative) and IPC—joined forces. Their collaboration aims to identify and address key circularity challenges in electronics manufacturing. This initiative gained momentum following a successful workshop at the Electronics Goes Green (EGG) conference in Berlin on June 17, 2024, setting the stage for a series of focused efforts to tackle the industry's most pressing circularity issues.
Key Challenges
The collaboration between iNEMI and IPC has identified four primary areas of focus in addressing circularity challenges.
Read more about these challenges in the Fall 2024 issue of IPC Community.
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