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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
December 9, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: Less than a minute

The electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
In response to these challenges, two industry leaders—iNEMI (International Electronics Manufacturing Initiative) and IPC—joined forces. Their collaboration aims to identify and address key circularity challenges in electronics manufacturing. This initiative gained momentum following a successful workshop at the Electronics Goes Green (EGG) conference in Berlin on June 17, 2024, setting the stage for a series of focused efforts to tackle the industry's most pressing circularity issues.
Key Challenges
The collaboration between iNEMI and IPC has identified four primary areas of focus in addressing circularity challenges.
Read more about these challenges in the Fall 2024 issue of IPC Community.
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Brent Fischthal - Koh YoungSuggested Items
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
AI Is the Golden Track Reviving Electronics and PCBs
08/06/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamRemember 2021? Despite COVID, the electronics industry hit a high. Then came the slide. By 2023, the industry was deep in the red. With inflation, policy shifts, and exchange rate shocks, the problems were long, and the outlook was bleak. Recovery finally appeared in 2024, but it was fragile. Automotive electronics slumped, wireless demand stayed soft, and the ride up was anything but smooth. Yet, amid the uncertainty, one bright track emerged: artificial intelligence (AI).
Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’
08/07/2025 | Dana Korf -- Column: Dana on DataThe global nature of electronics manufacturing requires clear, consistent, and precise communication, particularly in technical documentation. An area where miscommunication often arises is in interpreting drawing notes—small lines of text with the potential to dramatically impact product quality, manufacturing efficiency, and customer satisfaction.
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.