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ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung

05/08/2026 | ASE Group
Advanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung. 

GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend

05/08/2026 | GlobalFoundries
At its 2026 Investor Day, GlobalFoundries highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, underpinned by its broadening technology roadmap for the scaling of AI data centers and the proliferation of AI into the physical world, served from its unique, resilient global manufacturing footprint.

SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.

Sharp Increase in Global Semiconductor Sales in Q1 2026

05/05/2026 | ESIA
The European Semiconductor Industry Association (ESIA) reports that, in the first quarter of 2026, the global semiconductor market recorded a sharp increase of 79.2% year-on-year, reaching USD 298.55 billion in sales.

Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware

05/05/2026 | PRNewswire
Xanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.
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