Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
December 9, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB. The Coherent project in Sherman, TX will expand production of indium phosphide wafers. The SkyWater Technology project in Bloomington, MN will expand mature-node foundry capacity. And the X-FAB project in Lubbock, TX will expand production of silicon carbide wafers.
“The CHIPS Act investments announced today will reinforce U.S. supply chains for current-generation and mature-node semiconductors, thereby helping to strengthen America’s economic and national security. We applaud Coherent, SkyWater, and X-FAB for investing ambitiously in the domestic semiconductor ecosystem, and we applaud the Commerce Department for advancing these important incentives.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
09/05/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year to US$33.07 billion in the second quarter of 2025.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.