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SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
December 9, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB. The Coherent project in Sherman, TX will expand production of indium phosphide wafers. The SkyWater Technology project in Bloomington, MN will expand mature-node foundry capacity. And the X-FAB project in Lubbock, TX will expand production of silicon carbide wafers.
“The CHIPS Act investments announced today will reinforce U.S. supply chains for current-generation and mature-node semiconductors, thereby helping to strengthen America’s economic and national security. We applaud Coherent, SkyWater, and X-FAB for investing ambitiously in the domestic semiconductor ecosystem, and we applaud the Commerce Department for advancing these important incentives.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.
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GlobalFoundries, Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
02/17/2026 | BUSINESS WIREGlobalFoundries (GF) and Renesas Electronics Corporation (Renesas) announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas' access to GF technologies including its differentiated technology platforms.
Applied Materials Adds Samsung Electronics to $5B EPIC R&D Center
02/13/2026 | Applied MaterialsApplied Materials, Inc. announced that Samsung Electronics will join the new, $5 billion EPIC Center in Silicon Valley. Applied’s EPIC Center will open this year as the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment R&D.
Global Annual Semiconductor Sales Increase 25.6% to $791.7 Billion in 2025
02/12/2026 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $791.7 billion in 2025, an increase of 25.6% compared to the 2024 total of $630.5 billion.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2
02/16/2026 | Vern Solberg -- Column: Designer's NotebookAs the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded.
Infineon Raises €2B in Bonds to Refinance Debt and Acquisitions
02/11/2026 | InfineonInfineon Technologies AG has successfully placed corporate bonds with a volume of €2 billion under its European Medium Term Notes (EMTN) program.