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TTM Technologies Introduces Innovative Radio Frequency Components for Telecom Band n104 to Enhance 5.5G Applications
December 12, 2024 | Globe NewswireEstimated reading time: Less than a minute
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) has expanded its Radio Frequency and Specialty Components (RF&S) product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.
This release includes 18 new balun transformers, hybrid couplers, power dividers, RF crossovers, and terminations. These new products deliver superior performance and are an exceptionally effective overall cost solution with industry-standard Xinger® brand reliability. They have been specifically designed for needs in the 6.4 – 7.2 GHz band.
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Restoring U.S. Industrial Agility: Nurturing Domestic UAV Supply Chains
01/13/2026 | James Will, USPAEUnmanned aerial vehicles (UAV) illustrate the risk of globally dispersed electronics supply chains. But they also offer an opportunity for the U.S. to reimagine World War II’s “freedom’s forge” by building domestic electronics and component manufacturing that is hardwired for agility, speed, scalability and resilience.
Lattice Materials Awarded $18.5 Million from the U.S. Department of War
12/30/2025 | PRNewswireLattice Materials (Lattice), an advanced manufacturer specializing in custom-grown silicon and germanium crystals and part of The Partner Companies (TPC), announced it received an $18.5 million award from the U.S. Department of War (DoW) via Title III of the Defense Production Act (DPA) to further strengthen the U.S. supply chain for germanium and silicon.
TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning
12/23/2025 | TopLine CorporationFlip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.
ECTC 2026 Announces Student Innovation Challenge
12/23/2025 | ECTCThe premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced a Student Innovation Challenge for ECTC 2026, the conference’s 76th anniversary.
Target Condition: From Warped to Wonderful—Balancing Your Life, Career, and Your PCBs
12/16/2025 | Kelly Dack -- Column: Target ConditionIn the pursuit of a healthy work-life balance—and a healthy PCB design—one malefactor consistently stands in the way: stress. In life, biological stress creeps in through packed calendars, buzzing notifications, and the tug-of-war between personal and professional demands. Everywhere we look, we’re offered quick formulas to tame it, but some of these cheeky, Western world life hacks are all contrived to keep our minds and bodies from warping under pressure.