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TTM Technologies Introduces Innovative Radio Frequency Components for Telecom Band n104 to Enhance 5.5G Applications
December 12, 2024 | Globe NewswireEstimated reading time: Less than a minute
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) has expanded its Radio Frequency and Specialty Components (RF&S) product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.
This release includes 18 new balun transformers, hybrid couplers, power dividers, RF crossovers, and terminations. These new products deliver superior performance and are an exceptionally effective overall cost solution with industry-standard Xinger® brand reliability. They have been specifically designed for needs in the 6.4 – 7.2 GHz band.
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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
Talking with Tamara: Floor Planning Policies
09/04/2025 | Andy Shaughnessy, Design007 MagazineTamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.