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Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.

GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System

11/19/2024 | Gen3
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

11/14/2024 | KIC
KIC, the leader in smart thermal process technologies for electronics manufacturing, announces the launch of its TAS Software (Thermal Analysis System Software), an advanced solution designed to tackle new industry challenges and provide fresh opportunities in thermal profiling.

ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland

11/13/2024 | ITW EAE
ITW EAE, announces a new partnership agreement with Etek Europe to further expand its representation and distribution network. Under this agreement, Etek Europe will represent Despatch products in the United Kingdom and Ireland. 

DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024

11/13/2024 | DuPont
As the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich.
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