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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Inner Layer Precision & Yields Explored in December 2024 Issue of PCB007 Magazine
December 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Inner Layer Precision & Yields
As technology advances, the cost of a finished circuit board can amount to some very big numbers. Building accuracy into your inner layers as well as being able to assess their pass/fail status as early as possible is critical. Thus, whether automation cuts down on handling issues, additional in-process testing identifies defects earlier than final test, or you replace an old line with a superior process that improves product quality, increasing the accuracy in your inner layer production is essential for all PCB fabricators. Not doing so will ensure that, eventually, you will no longer be in this game. In this month’s PCB007 Magazine, we take a close look at building precision into your inner layers.
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The Chemical Connection: Changes and Challenges Ahead in PCB Fabrication
02/09/2026 | Don Ball -- Column: The Chemical ConnectionWhat are the most influential changes in PCB fabrication in the next five years? Throughout my many years in the PCB industry, I have witnessed numerous predictions about the industry's future, as well as the introduction of alternative processes that promised to revolutionize the industry. Most of the more radical predictions have fallen by the wayside, and those alternative processes have failed to produce the predicted results, becoming niche processes at best.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/08/2025 | Andy Shaughnessy, I-Connect007If you’ve been watching the news lately, you might be tempted to opine, “What’s going on here?” In this week’s must-reads, we have a wrap-up of the latest news about U.S. tariffs with Asia, and columnist Tom Yang explains why some PCB fabrication business should remain in China. We also have a piece that examines the unprecedented growth that green manufacturing is expected to see over the next four years.
Driving Innovation: Inner Layer Alignment Methods in PCB Production
08/06/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.
Sierra Circuits Boosts High Precision PCB Manufacturing with Schmoll Technology
06/16/2025 | Schmoll AmericaSierra Circuits has seen increased success in production of multilayer HDI boards and high-speed signal architectures through the integration of a range of Schmoll Maschinen systems. The company’s current setup includes four MXY-6 drilling machines, two LM2 routing models, and a semi-automatic Optiflex II innerlayer punch.
Driving Innovation: Registration in PCB Production Throughout the Process
05/06/2025 | Simon Khesin -- Column: Driving InnovationPCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.