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GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25

12/18/2024 | TrendForce
As the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.

Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.

Jabil Introduces New High-Performance, Purpose-Built AMD and Intel Servers Optimized for AI, FinTech, and Cloud Applications

10/14/2024 | BUSINESS WIRE
Jabil Inc. announced that it is expanding its server portfolio with the J421E-S and J422-S servers, powered by AMD 5th Generation EPYC™ and Intel® Xeon® 6 processors.

Jabil Acquires Mikros Technologies

10/03/2024 | BUSINESS WIRE
Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
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