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Marcy’s Musings: Boosting Your Inner Layer Precision and Production Outcomes

If you went to college, it’s likely you did so because your parents told you that getting your education would provide a firm foundation to build a successful career. But attending college is not the end-all, be-all of creating a successful career, especially in our industry which offers many great opportunities that do not require that kind of higher education. Of course, you can’t argue that education and training provide a solid foundation upon which to build and lead to eventual success in an undertaking.

In much the same way, inner layer manufacturing provides the solid foundation upon which quality printed circuit boards are built. Nothing speaks directly to bottom-line profitability more than good yields. As technology advances, the cost of a finished circuit board can get to some very big numbers, so it’s critical to build accuracy into your inner layers and assess their pass/fail status as early as possible. Thus, whether automation cuts down on handling issues, additional in-process testing identifies defects earlier than final test, or you replace an old line with a superior process that improves product quality, increasing the accuracy in your inner layer production is essential for all PCB fabricators. Not doing so will ensure that, eventually, you will no longer be in this game.

In this month’s issue of PCB007 Magazine, we take a closer look at building precisions into your inner layers. Tony Faraci, president and owner of equipment maker DIS, discusses the journey of inner layer registration technology in the industry, having watched it from the early days of pin lamination to today’s more automated, pinless solutions. Andrew Kelley of XACT PCB talks about data and an increased ability to use it well, given the many new tools that make a significant difference toward achieving high yields the first time. RoBAT’s Bruce Nockton talks about the evolution of test solutions and SCARA technology. Todd Kolmodin of Guardien, our 4-wire Kelvin expert, discusses how using the Kelvin method can help to detect plating anomalies in via barrel or bonding in the microvias. Finally, Dr. Patrick Valentine of Uyemura talks about statistically measuring inner layer yield improvement.

Also this month, Don Ball provides a primer on the nuances of etching and addresses the question of spray nozzles and fluid dynamics, adeptly illustrating just one aspect of its full complexity. Happy Holden talks about photonic assembly and the LEGO principle. Manfred Huschka wraps up his two-part series on China Plus One, focusing on Southeast Asia, and the not-insignificant challenge of filling the projected need for 70,000 skilled workers in that region. He continues examining how much de-risking is truly feasible given the myriad challenges ahead for China Plus One companies.

Our special series on the IPC Hall of Fame Award continues as Dan Feinberg highlights Gene Weiner this month. Carey Burkett of Flexible Circuit Technology shares some big news, including the introduction of his new executive vice president, Ray Cottrell, and PCBAA Chair Shane Whiteside recounts PCBAA’s accomplishments in advocacy throughout 2024. He discusses a potential tax credit for American manufacturers and emphasizes the need for continued patience and perseverance for the battle ahead.

Happy holidays, and I hope you enjoy this read.

This column originally appeared in the December 2024 issue of PCB007 Magazine.