Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
December 17, 2024 | ACCESSWIREEstimated reading time: 2 minutes
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.
The Coater enables 2.5D packaging-a next-generation semiconductor production technology-to be applied to larger substrates. Specifically, it is capable of creating detailed rewiring layers on glass substrates for use in interposers, which are a key component of integrated circuits. In this way, the Coater facilitates the production of high-performance semiconductors.
Toray Engineering has already delivered pilot TRENG-PLP Coaters to a number of major semiconductor manufacturers to demonstrate its capabilities. Now, the company is preparing to mass-produce the devices, and is targeting orders totaling 20 million USD by fiscal 2025, and 40 million USD by fiscal 2030.
In recent years, increased demand for generative AI servers has resulted in a proliferation of hyperscale data centers. As semiconductor performance has improved, the market for high-performance semiconductors has expanded rapidly; at the same time, this technological progress has driven demand for larger-scale and more efficient advanced semiconductor packaging, which is indispensable for the production of advanced semiconductor devices.
Interposers are a key component in advanced semiconductor packaging, and are traditionally made of silicon. However, since interposers are square and silicon wafers are round in shape, cutting square interposers out of 300mm-diameter round silicon wafers inevitably results in waste silicon. Moreover, as semiconductor performance increases, package sizes have been increasing year on year, leading to fears of further decreases in production efficiency.
PLP technologies, which use 600mm-square glass substrates, are seen as a potential solution to the above problems. The larger area of the glass substrate means that larger-scale packages can be produced compared to what is possible with silicon wafers, while its square shape means that the entire substrate can be effectively used to create square interposers without resulting in unused substrate.
Yet the use of PLP technologies to create circuits is not without its own issues: warping of the glass substrate must be prevented, while the wiring materials and photoresist materials must be of a uniform thickness.
To prevent warping, Toray Engineering has developed new technologies for the handling of large glass substrates, drawing on proprietary coating technologies for LCD panels, which are capable of controlling thickness with a high degree of precision. These technologies enable the TRENG-PLP Coater to create high-density rewiring layers on 600mm-square glass substrates.
Building on Toray's production technologies for advanced fiber materials, Toray Engineering has developed and refined microfabrication technologies for use in semiconductor packaging equipment, display production equipment, and a wide range of other equipment used in the field of electronics.
Going forward, the company will continue to utilize its high-level production technologies to provide solutions that contribute to society's forward progress.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings
10/24/2025 | SEMITo help meet the growing demand for skilled workers in the U.S. semiconductor and microelectronics industry, the National Network for Microelectronics Education (NNME), operated by the SEMI Foundation, announced the launch of ChipPath, a first-of-its-kind, AI-enabled career platform that connects individuals directly to real opportunities across the industry.
STMicroelectronics Reports Q3 2025 Financial Results
10/23/2025 | Globe NewswireSTMicroelectronics N.V. , a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 27, 2025.
Zhen Ding Highlights AI PCBs, IC Substrates at TPCA 2025
10/22/2025 | Zhen DingThe annual PCB industry event, TPCA Show 2025, kicked off on October 22 at the Nangang Exhibition Center. Zhen Ding Tech Group showcased a full range of high-end PCBs and IC substrates under the theme of artificial intelligence (AI).
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Pixelworks Announces Definitive Purchase Agreement to Sell its Shanghai Semiconductor Subsidiary to VeriSilicon
10/16/2025 | PRNewswirePixelworks, Inc., a leading provider of innovative video and display processing solutions, today announced that it has signed a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd., a company organized under the laws of the People's Republic of China and a subsidiary of Pixelworks, to a special purpose entity led by VeriSilicon Microelectronics (Shanghai) Co., Ltd.