Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
Share on:
Suggested Items
Celestica Announces Q1 2025 Financial Results
04/25/2025 | Globe NewswireCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world's most innovative companies, announced financial results for the quarter ended March 31, 2025 (Q1 2025).
Element Solutions Inc Announces 2025 First Quarter Financial Results
04/25/2025 | BUSINESS WIREElement Solutions Inc., a global and diversified specialty chemicals company, announced its financial results for the three months ended March 31, 2025.
TRI at SMTA Wisconsin Expo 2025
04/24/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.