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IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute

Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.