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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
December 19, 2024 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the release of Design for Reality: Scaling from Prototype to Volume Production, written by Matt Stevenson of ASC Sunstone Circuits. This essential resource and companion guide builds on the foundational insights presented in The Printed Circuit Designer’s Guide to... Designing for Reality and delivers advanced strategies for scaling PCB production.
In his original book, Stevenson detailed the unwritten rules, best practices, and design requirements that enable designers to create manufacturable and robust PCB designs. Drawing from Sunstone Circuits’ 50 years of manufacturing expertise, Stevenson emphasized the importance of understanding the nuances of the production process to achieve reliability and cost-efficiency in PCB designs.
Now, The Companion Guide to... Designing for Reality takes these lessons to the next level, addressing the complexities of scaling from prototype to mass production. It provides guidance on:
- Selecting the right manufacturing partner for each stage of production
- Anticipating and mitigating common scaling challenges
- Ensuring cost-effective, high-quality designs for large-scale production
Whether you're a designer working on initial prototypes or scaling up to mass production, this guide is an invaluable tool for navigating the intricate realities of PCB manufacturing.
Available Now! Learn more and get your copy here.
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Rachael Temple - AlltematedSuggested Items
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Element Solutions Reports Record Quarterly Results and Increases 2026 Full Year Guidance
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Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
TPCA and Industry Leaders Convene in Bangkok for Thailand PCB Summit
04/30/2026 | TPCAAt a critical juncture of global supply chain restructuring and the explosive growth in demand for AI computing power, Thailand is becoming a crucial hub for the next wave of high-end manufacturing in the electronics and circuit industry.
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.