-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Are Our Stackup Rules No Longer Valid?
December 19, 2024 | Cherie Litson, EPTAC MIT CID/CID+Estimated reading time: 1 minute

Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else.
If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources. The trick is to first define your electrical and mechanical requirements, then work with your fabricator to find the savings (i.e., profits) for both the customer and fabricator.
So, how do you navigate all the rules? First, keep learning. Get certified through the CID and CID+ exams. Go to conferences such as IPC APEX EXPO, SMTAI, and PCB West. Stay up to date through trade publications, such as Design007 and PCB007 magazines.
If cost is not an issue, and you have an in-house fabrication and assembly shop, you can experiment with all kinds of options. Just be sure to research the physics so you don’t hurt yourself or others.
If cost is a factor (as it is for most of us) and you are sending the design out to find the lowest cost for fab and assembly, you may need to follow the guidelines a bit more diligently. You can still be creative but understand the tradeoffs for what you want to do. Work with the fabricator(s) you select and find out what’s possible within your budget. Use the IPC-1730 and IPC-1720 specifications to be sure you’ve asked the fabricator and assembler all the right questions. The things that are called out are somewhat customizable per fabricator, and using these specs will help you get consistent answers and fabrication price quotes.
Hole sizes and aspect ratios, component pin spacing, and product sizes are getting smaller all the time. How can we navigate the demands of these conditions with the existing manufacturing processes that exist out there?
To read this entire article, which appeared in the December 2024 issue of Design007 Magazine, click here.
Suggested Items
Localized Automation Becomes a Tariff Storm Safe Haven, but U.S. Smart Factory Build-Out Costs Far Exceed China’s
05/09/2025 | TrendForceTrendForce’s latest “Human-Machine Technology Report” points out that although the 90-day delay on the U.S. reciprocal tariffs announced by the Trump administration in early April 2025 offers temporary relief, it has already triggered lasting shifts in global manufacturing and supply chain strategies.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
05/08/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfSometimes, a book comes along that challenges everything you thought you knew about your profession. For those in marketing, PR, or advertising, Ryan Holiday’s "Growth Hacker Marketing: A Primer on the Future of PR, Marketing, and Advertising" is that book. It’s a powerful manifesto for a new era of marketing.
Panel Driver IC Price Decline Slows in 1H25; Gold Prices, China Subsidies, and U.S.-China Tariffs Emerge as Key Variables
04/28/2025 | TrendForceTrendForce’s latest investigation finds that China’s subsidy policies and rising concerns over reciprocal tariffs are reshaping brand strategies in the panel market, indirectly influencing price trends for panel driver ICs.
New IDTechEx Report Examines How QLC SSDs Are Disrupting the HDD Storage Market
04/24/2025 | PRNewswireFor enterprises, data storage is not just a technical challenge but a financial one. The new report from market intelligence firm IDTechEx, "Emerging Memory and Storage Technology 2025-2035: Markets, Trends, Forecasts", provides an in-depth analysis of the evolving storage landscape and its impact on cost, efficiency, and scalability.