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Where Will the Next Generation of Great Engineers Come From?

08/26/2026 | Brian Buyea, Remtec
Most young engineers do not grow up dreaming about careers in ceramic substrates or plating processes. It’s not because these careers are uninteresting. In many cases, young people simply do not know they exist. They are excited about AI, robotics, aerospace, autonomous vehicles, space exploration, renewable energy, electric vehicles, medical technology, and advanced computing. What many students do not yet understand is that virtually every one of those technologies depends upon an incredibly sophisticated electronics manufacturing infrastructure.

Decoding the CMMC Suspension

08/25/2026 | Divyash Patel, MX2 Technology
The recent CMMC suspension put all of us in something of a state of shock and confusion, and I have been closely following the discussion in the Defense Industrial Base (DIB) community, including vendors, customers, and cybersecurity specialists. In a memo to my clients, I shared some details for the decision. A common theme among those reasons is cost and capacity. We’ve learned that CMMC has prohibitive compliance costs, with individual bills approaching $600,000; SBA estimates above $7 billion annually across the base, that there is a severe assessor shortage; roughly 100,000+ firms need assessments from only about 100 approved organizations and that the DoD stood up a 60-day CMMC Reform Task Force to recommend a lower-barrier replacement framework.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/21/2026 | Michelle Te, I-Connect007
Some situations came up for me this week (delayed flights and malfunctioning work software) that highlighted how much we rely on tools every day. When they’re working, we barely think about them. When they’re not, we’re suddenly reminded of everything else that has to be in place for the work to get done: good processes, knowledgeable people, communication, teamwork, and sometimes ingenuity. I’ve observed that engineers aren’t any different in their work.

P Kay Metal's MS2 Dross Eliminator Delivers Measurable Results for Electronics Manufacturers Across Latin America

08/20/2026 | P. Kay Metal, Inc.
P Kay Metal is seeing growing adoption of its MS2 Dross Eliminator throughout the region, with customers consistently reporting solder recovery rates of 80–85%.

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.
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