-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
December 25, 2024 | U.S. Department of CommerceEstimated reading time: 2 minutes
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. Amkor, the largest U.S.-based outsourced semiconductor assembly and test company (OSAT), is regarded as one of the global leaders in advanced packaging technology which is critical to supporting leading-edge clusters and helping meet the growing demand for AI chips. This award will directly support Amkor’s investment of approximately $2 billion in a greenfield advanced packaging and test facility in Peoria, Arizona and is expected to create an estimated 2,000 manufacturing jobs, and, at the peak of construction, more than 2,000 construction jobs. The award comes after the previously signed preliminary memorandum of terms, announced on July 26, 2024, and the completion of the Department’s due diligence. The Department will disburse the funds based on the company’s completion of project milestones.
“Advanced packaging is a critical part of the semiconductor supply chain, and bringing this capability to the U.S. will mean chips don’t need to be sent overseas after they have been manufactured,” said U.S. Secretary of Commerce Gina Raimondo. “Thanks to Amkor’s investment in Arizona, the U.S. will have the world’s most leading-edge packaging technologies for the first time, enhancing domestic supply chain resilience and establishing the U.S. as a global technology leader for decades to come. Amkor’s project will support critical industries, such as AI and high-performance compute, and create thousands of high-paying jobs.”
“Today’s award with Amkor secures critical advanced packaging technology needed to strengthen our leading-edge manufacturers and ensure we can meet the booming demand for AI right here in America,” said National Economic Advisor Lael Brainard. “The CHIPS and Science Act is helping the United States maintain its lead in the industries of the future.”
“We are pleased to announce that we have finalized the terms for receiving CHIPS Act funding to establish an advanced packaging and test facility in Arizona,” stated Giel Rutten, President and CEO of Amkor. “This new facility will serve as a critical cornerstone in establishing a robust semiconductor manufacturing supply chain within the United States. This milestone would not have been possible without the invaluable support from the Department of Commerce and our dedicated partners across federal, state, and local agencies.”
As stated in the CHIPS Notice of Funding Opportunity for Commercial Fabrication Facilities, CHIPS for America will distribute direct funding to recipients for capital expenditures based on the completion of construction, technology, production, and commercial milestones. The program will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions.
Suggested Items
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.