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Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.

Airbus, Singapore Successfully Complete HTeaming Flight Trials

02/09/2026 | Airbus
Airbus and Singapore’s Defence Science and Technology Agency (DSTA) have successfully concluded a pioneering HTeaming flight campaign at a Singapore airbase.

LPMS USA and Bostik Announce Joint Technical Webinar on Low Pressure Molding and New Outdoor Electronics Innovation

02/04/2026 | LPMS USA
LPMS USA, a leader in low-pressure molding solutions, is proud to have partnered with Bostik to host a live technical webinar focused on electronic encapsulation using low-pressure molding and the launch of Bostik’s newest outdoor grade material, Thermelt® 964.

Connect the Dots: The Future of Designing for Reality—Pattern Plating

02/05/2026 | Matt Stevenson -- Column: Connect the Dots
Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.

Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026

02/02/2026 | Dr. Shawn DuBravac, Global Electronics Association
Global Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.
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