Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Knocking Down the Bone Pile: Basics of Component Lead Tinning

04/02/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
The component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.

UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony

04/01/2025 | BUSINESS WIRE
United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony.

Foxconn Names Kathy Yang Rotating CEO, Strengthening Leadership Ranks

03/31/2025 | Foxconn
Underscoring a strong commitment to grow next generation leaders, Hon Hai Technology Group (Foxconn) has named Kathy Yang Chiu-chin its rotating Chief Executive Officer, effective Monday, setting two major milestones in corporate governance leadership for the world’s largest electronics manufacturing service provider.

Delvitech Expands Its Presence in Germany with the Appointment of Bijan Thomas Rahideh as Representative

03/31/2025 | Delvitech
Delvitech, a leader in AI-driven automated optical inspection solutions, is strengthening its position in the German-speaking market by appointing Bijan Thomas Rahideh as its representative for Bavaria, Austria, and German-speaking regions of Switzerland.

STMicroelectronics Recognized as Top 100 Global Innovator 2025 for the Seventh Time

03/24/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has been named in the Top 100 Global Innovators 2025.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in