It’s Only Common Sense: 20 Lessons in 20 Years—A Career in Common Sense
The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
Zhen Ding Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau
December 30, 2024 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported, obtained the investment application of its subsidiary in Kaohsiung Al Park approved by the Southern Taiwan Science Park Bureau.
It is estimated that the future investment amount is NT$2 billion. In addition to the research and development and production of high-layer counts RPCB and high-density Interconnects boards (HLC-HDI) for Al server needs, in order to cooperate with important customers to develop the technology required for the next generation of high-end hardboard products, a hardboard research and development center will be built simultaneously in the STSP branch to establish relevant technical capabilities early, and through cooperation with important customers, it will cultivate printed circuit board technical talents with an international view to respond to the era of rapid competition in the future.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,