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AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
December 31, 2024 | AGC Multi Material AmericaEstimated reading time: Less than a minute
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
Visit us at Booth 1238 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
DesignCon is the premier high-speed communications and system design conference and exposition.
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Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.