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GlobalFoundries, IBM Announce Settlement and Resolution of All Litigation Matters
January 3, 2025 | GlobalFoundriesEstimated reading time: Less than a minute
GlobalFoundries (GF) and IBM announced that the two companies have reached a settlement in their ongoing lawsuits, resolving all litigation matters, inclusive of breach of contract, trade secrets and intellectual property claims between the two companies. This settlement marks the end of an ongoing legal dispute and allows the companies to explore new opportunities for collaboration in areas of mutual interest.
The details of the settlement are confidential and both parties have expressed satisfaction with the outcome.
“We are pleased to have reached a positive resolution with IBM, and we look forward to new opportunities to build upon our long-standing partnership to further strengthen the semiconductor industry,” said Dr. Thomas Caulfield, president and CEO of GF.
“Resolving these disputes is a significant step forward for our companies and will allow us to both focus on future innovations that will benefit our organizations and customers,” said Arvind Krishna, Chairman and CEO of IBM.
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Brent Fischthal - Koh YoungSuggested Items
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
TSMC and South Korean Rivals Lose U.S. Fast-Track Export Privileges for China
09/03/2025 | I-Connect007 Editorial TeamWashington has revoked Taiwan Semiconductor Manufacturing Co.’s (TSMC) special fast-track status for U.S. chip-making equipment exports to its Nanjing, China, plant, Reuters reported on Sept. 2. The move comes days after similar actions against South Korean chip makers Samsung Electronics and SK Hynix.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Power Shift in U.S. Manufacturing Ownership
08/20/2025 | Nolan Johnson, I-Connect007The U.S. manufacturing landscape is driven by reshoring initiatives, supply chain realignments, and a surge of foreign interest. What does that mean for U.S.-based PCB and EMS companies? In this interview, mergers and acquisitions expert Tom Kastner breaks down the forces reshaping the industry—why foreign investors are eager to enter the U.S. market, why many are evaluating greenfield facilities over acquisitions, and why the high-mix, low-volume focus of most domestic shops doesn’t always align with foreign buyers’ goals.