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Würth Elektronik at embedded world 2025

02/06/2025 | Wurth Elektronik
In addition to new components from the fields of wireless connectivity, power magnetics, optoelectronics and electromechanics, Würth Elektronik will also be presenting a pioneering concept at embedded world from March 11 to 13:

Teledyne HiRel Semiconductors Releases Wideband 50 GHz RF Switch

02/05/2025 | BUSINESS WIRE
Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T. This switch operates from true DC to 50 GHz, delivering excellent RF performance down to zero Hertz, making this device ideal for many of today’s complex space and defense applications.

EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/04/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

Koh Young Highlights Inspection Solutions at IPC APEX EXPO 2025

02/04/2025 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for live demonstrations of its award-winning inspection technologies.

EXTOLL Collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/03/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
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