Indium Experts to Present on Power Electronics at PCIM Europe 2025

Estimated reading time: 3 minutes

As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.

Tuesday, May 6 

• Materials Technology for Flux-Free Soldering Applications in Power Electronics by Product Manager for ESM/Power Electronics Joseph Hertline.
  • This e-Mobility session will spotlight flux-free soldering applications using Indium Corporation’s Fluxless Assembly Solder Technology (FAST). The talk will outline best practices for flux-free reflow methodologies, including using novel solder paste technology to reduce process steps, cycle times, and improve efficiency in mass production.
• Reducing Effort in Secondary Processes of Power Module Manufacturing Through Adapted Solder Paste Systems by Regional Technical Manager and Technologist for Advanced Applications Andreas Karch.
  • This vendor presentation will discuss how optimized solder pastes can minimize or eliminate the need for cleaning processes, thereby increasing the cost-efficiency of manufacturing modern power modules.

Wednesday, May 7

• Design Considerations for Soldering Material Selection in Power Module Package-Attach by Senior Applications Development Engineer for ESM Ryan Mayberry.
  • In an e-Mobility-focused session, this presentation will discuss soldering material selection for power module package-attach in EV inverter systems. It will dive into a detailed comparison of advanced solutions like Indalloy^®276 and  Indalloy^®301LT, while showcasing the critical role of InFORMS^® in optimizing strength and bondline thickness for solder preforms. The presentation will also examine trade-offs in materials selection based on mission profiles and end-use of systems, with a focus on cost-of-ownership and thermal management. 
• The Effect of Accelerated Aging on Solder Shear Strength for Package-Attach in Power Electronics, by Ryan Mayberry.
  • This poster presentation will focus on the implementation of a fast, practical solder evaluation method for package- or module-attach applications in power electronics. Shear strength is used as a quantitative test method to establish correlations to key characteristics such as solderability, wetting, delamination, thermal resistance, and thermo-mechanical reliability under accelerated aging conditions.
• Advancements in Formic Acid Soldering Materials Technology for Power Device Packaging, by Product Manager (Semiconductor) Dean Payne.
  • This poster presentation will explore a novel flux-free solder paste technology for use in power discrete components and power modules, including die-attach, interconnect, and component soldering. The presentation highlights how formic acid soldering enables ultra-low voiding, optimal RDS-on, and thermal performance. Empirical data will be shared to characterize solder voiding and demonstrate the scarcity of residue under industry-common reflow scenarios, as measured through TGA and surface analysis.

Andreas Karch provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of experience in automotive and power electronics, including developing advanced customized solutions.

Joseph Hertline is responsible for driving the growth of the power electronics product line by developing and implementing marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market.

Ryan Mayberry is responsible for generating test strategies, data sets, and application guidelines for the engineered solder materials (ESM) product line. He collaborates with the sales, research and development (R&D), operations, and quality departments as a subject matter expert to enable key pursuits in the growing power electronics and thermal market segments by developing process recommendations and supporting new product qualifications for a successful customer experience.

Dean Payne is a Product Manager (Semiconductor) responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials. Dean is based at Indium Corporation’s Asia-Pacific Operations in Singapore.

To learn more about Indium Corporation’s solutions for power electronics and e-Mobility, be sure to visit our experts at PCIM in hall 6, booth #358.