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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Wistron Technology (Malaysia) Honored as ‘Best Companies to Work for in Asia’ for Third Consecutive Year
January 7, 2025 | WistronEstimated reading time: Less than a minute
Wistron Technology (Malaysia) has been recognized as one of the “Best Companies to Work for in Asia” for the third consecutive year by HR Asia, a leading publication for human resources professionals.
The HR Asia Best Companies to Work for in Asia Awards recognize organizations that have been identified by their employees as top employers in the region. This prestigious award reflects Wistron’s commitment to fostering a positive and rewarding work environment for its employees in Malaysia.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Strengthening U.S.-Japan Industry Ties
08/11/2025 | Yusaku Kono, Global Electronics Association—East Asia Japan RepresentativeThe Global Electronics Association-East Asia (formerly known as IPC East Asia) hosted a high-level Executive Roundtable in Tokyo on March 5, bringing together more than 50 senior executives, policymakers, and experts from Japan’s electronics and manufacturing sectors.
A Vision for India and Beyond: Gaurab Majumdar's Leadership Across the Southern Hemisphere
07/23/2025 | Michelle Te, Community MagazineGaurab Majumdar, vice president of the Global Electronics Association—India, Southeast Asia, Middle East, and Africa, joined the Global Electronics Association (formerly known as IPC) in 2020 and has taken full advantage of the industry's enormous growth by leading the Global Electronics Association—India to increase membership and certification by 40%, partnering with more than 50 companies to promote the benefits of Association membership, and collaborating with more than 20 government stakeholders.
Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference
06/16/2025 | Pete Starkey, I-Connect007It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.
Celebrating Leadership, Legacy and the Future of Southeast Asia’s Semiconductor Industry
05/26/2025 | SEMIOn the occasion of its 30th anniversary, SEMICON Southeast Asia (SEA) 2025 hosted the Night of Leaders, a dinner and awards ceremony that honoured individuals shaping the region’s semiconductor future.
SEMICON Southeast Asia 2025 Mega Show Opens in Singapore with Top Global C-suite Executives at Inaugural CEO Summit
05/21/2025 | SEMISEMICON Southeast Asia (SEA) 2025, the region’s flagship global electronics manufacturing and semiconductor supply chain event, officially opened today at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore.