Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
SMTA Announces Wafer-Level Packaging Symposium Program
January 8, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
The technical program features a special keynote presentation. On Wednesday, February 19, 2025, Eric Breckenfeld, Nvidia, and Erik Hadland, Semiconductor Industry Association, will co-present, “The CHIPS and Science Act: Past, Present and Future of U.S. Microelectronics R&D.”
Technical sessions include over 20 expert speakers who delve into wafer-level packaging advances, assembly/integration process, novel interconnect & packaging process and materials, substrate/integration platform, test & metrology, fan-out wafer-level packaging, and more. The program features presentations from leading companies including adeia, Nvidia, NHanced Semiconductors, Semiconductor Industry Association, and universities such as Hanyang University, Yokohama National University, and more.
The symposium kicks off with two professional development courses on Tuesday, February 18, 2025. The first course, “Materials for Semiconductor Packaging,” will be instructed by Terry Alford, Arizona State University. Gamal Refai Ahmed, Ph.D., AMD, will instruct the second course, “Current & Future Challenges and Solutions in AI & HPC System & Thermal Management.” Access to these courses is included in standard registration.
Registration for this event is open. Click here to register. Discounted rates are available by registering on or before January 27, 2025. All presentations, professional development courses and events open to attendees are included in registration.
Share on:
Suggested Items
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
France, Spain Renew Commitment to the Airbus A400M Programme
06/17/2025 | AirbusAirbus and OCCAR have reached an agreement with the A400M launch nations to secure production for the programme for the foreseeable future, improve the cost of operations, and jointly develop new capabilities.