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AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030

05/09/2025 | IDTechEx
By 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.

Localized Automation Becomes a Tariff Storm Safe Haven, but U.S. Smart Factory Build-Out Costs Far Exceed China’s

05/09/2025 | TrendForce
TrendForce’s latest “Human-Machine Technology Report” points out that although the 90-day delay on the U.S. reciprocal tariffs announced by the Trump administration in early April 2025 offers temporary relief, it has already triggered lasting shifts in global manufacturing and supply chain strategies.

Axxon-Mycronic Promotes Eric Ting to Sales Director, Southeast Asia

05/09/2025 | Axxon-Mycronic
Axxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is excited to announce the promotion of Eric Ting to the role of Sales Director, Southeast Asia (SEA), effective immediately. In this new position, Eric will report directly to Serena Wei Li, HV Marketing & Overseas Sales Director.

Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems

05/08/2025 | Cadence Design Systems
At its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.

Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference

05/06/2025 | Indium Corporation
Indium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
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