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TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
January 9, 2025 | TopLineEstimated reading time: 1 minute
TopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
The objective of the Wire Bonding Workshop is to create a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding. According to TopLine CEO Martin Hart, “This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies available related to the use of Wire Bonding in battery packs, and in semiconductor and microelectronic packaging.” The workshop will be held at the Westin San Diego Bayview.
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