Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Sony Honda Mobility Inc. (SHM) and Qualcomm Technologies, Inc. have announced the expansion of their technology collaboration to integrate the latest generation of Snapdragon® Digital Chassis™ solutions into its future AFEELA vehicles, marking a significant advancement in the development of software-defined vehicles (SDVs). The next phase of this collaboration aims to enhance the next generation of AFEELA vehicles with cutting-edge features, including edge generative artificial intelligence (GenAI) for more intuitive and personalized in-car experiences, advanced driver assistance systems (ADAS), and seamless connectivity powered by Qualcomm Technologies’ comprehensive, cloud-connected Snapdragon Digital Chassis solutions. The companies' expanded relationship underscores Sony Honda Mobility and Qualcomm Technologies’ continued commitment to delivering state-of-the-art technology and unparalleled user experiences in the automotive industry.
This expanded collaboration between SHM and Qualcomm Technologies is set to redefine SHM’s vision by delivering AFEELA vehicles that are smart, connected, and truly reflective of Sony's legacy in high-quality entertainment and Honda's commitment to automotive excellence. Together, SHM and Qualcomm Technologies are paving the way for a future where technology and mobility seamlessly converge, providing drivers and passengers with a next-generation automotive experience.
The First AFEELA vehicles equipped with Snapdragon Digital Chassis solutions are expected to start deliveries in 2026. Reservations will be available this year.
Snapdragon Digital Chassis platforms for AFEELA vehicles:
- The Snapdragon® Cockpit Platform powers AFEELA's in-vehicle entertainment and cockpit, delivering high-quality audio and rich 3D visual experiences to enable enjoyable and immersive moments in the car, whether you're listening to music, watching a movie, or playing a game. Leveraging the platform’s support for GenAI capabilities, SHM will transform the cabin into a digital haven, offering personalized content and AI enabled interactive features that enhance the driving and passenger experience.
- Snapdragon® Auto Connectivity Platforms offer robust, security-rich connectivity for infotainment systems and precise positioning to enable secure vehicle connection, providing comprehensive access to entertainment, navigation, and other digital services.
- Snapdragon® Ride Platform provides AFEELA with an open and customizable solution for developing advanced driver assistance system (ADAS) features. This platform offers flexibility with low power and high throughput and a production-grade toolchain for AI integration and data handling. The Snapdragon Ride solution is designed with safety and advanced automation in mind, enabling the creation of sophisticated systems that offer a smooth, automated driving experience.
“Our collaboration with Sony Honda Mobility underscores our unwavering commitment to advancing automotive technology for next-generation vehicles,” said Nakul Duggal, group general manager, automotive, industrial, and loud, Qualcomm Technologies, Inc. “We are thrilled to strengthen our relationship by equipping upcoming AFEELA vehicles with cutting-edge technologies like GenAI, delivering premium, sophisticated, and safety-rich riding experiences that redefine the future of mobility.”
"By integrating Qualcomm Technologies’ Snapdragon Digital Chassis and GenAI into our AFEELA brand, we are taking a significant step towards realizing our vision of software-defined vehicles,” said Izumi Kawanishi, representative director, president, chief operating officer, Sony Honda Mobility. “This relationship allows us to offer our customers a seamless and connected driving experience, combining the best of automotive and digital innovation, and transforming the mobility space into an entertainment space.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Insulectro Promotes Chris Hunrath to Chief Technology Officer
09/29/2025 | InsulectroInsulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, has promoted longtime employee Chris Hunrath to Chief Technology Officer (CTO).
TTM Technologies Expands Ultra Small Radio Frequency Components Offering for Telecom, Test and Measurement, and COTS Mil-Aero Applications
09/22/2025 | Globe NewswireTTM Technologies, Inc continues to innovate in the field of Radio Frequency & Specialty (RF&S) components with the introduction of new ultra small RF crossover and splitter components. Building on TTM’s commitment to meet the evolving demands within the Telecom, Test and Measurement, and Commercial Off-the-Shelf (COTS) Mil-Aero sectors, these latest offerings further enhance our product lineup.
Industry Expert, Mark Finstad From Flexible Circuit Technologies Presents Ask the Flexperts at PCB West
09/22/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies., Inc/FCT is excited to announce its upcoming session, Ask the Flexperts taking place Thursday, October 2nd, from 9:00–11:00 AM at PCB West 2025. The session will be led by Mark Finstad, Director or Applications Engineering at FCT, who brings over 40 years of experience in the design, fabrication, and testing of flexible and rigid-flex circuits. Mark is an internationally recognized authority in the field, making this a must-attend event for PCB designers, engineers, and industry professionals.
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
09/17/2025 | PRNewswireOrthogone Technologies Inc., a leader in advanced embedded systems and FPGA development, is proud to announce its official designation as a Texas Instruments (TI) Design Services Partner.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.