Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Sony Honda Mobility Inc. (SHM) and Qualcomm Technologies, Inc. have announced the expansion of their technology collaboration to integrate the latest generation of Snapdragon® Digital Chassis™ solutions into its future AFEELA vehicles, marking a significant advancement in the development of software-defined vehicles (SDVs). The next phase of this collaboration aims to enhance the next generation of AFEELA vehicles with cutting-edge features, including edge generative artificial intelligence (GenAI) for more intuitive and personalized in-car experiences, advanced driver assistance systems (ADAS), and seamless connectivity powered by Qualcomm Technologies’ comprehensive, cloud-connected Snapdragon Digital Chassis solutions. The companies' expanded relationship underscores Sony Honda Mobility and Qualcomm Technologies’ continued commitment to delivering state-of-the-art technology and unparalleled user experiences in the automotive industry.
This expanded collaboration between SHM and Qualcomm Technologies is set to redefine SHM’s vision by delivering AFEELA vehicles that are smart, connected, and truly reflective of Sony's legacy in high-quality entertainment and Honda's commitment to automotive excellence. Together, SHM and Qualcomm Technologies are paving the way for a future where technology and mobility seamlessly converge, providing drivers and passengers with a next-generation automotive experience.
The First AFEELA vehicles equipped with Snapdragon Digital Chassis solutions are expected to start deliveries in 2026. Reservations will be available this year.
Snapdragon Digital Chassis platforms for AFEELA vehicles:
- The Snapdragon® Cockpit Platform powers AFEELA's in-vehicle entertainment and cockpit, delivering high-quality audio and rich 3D visual experiences to enable enjoyable and immersive moments in the car, whether you're listening to music, watching a movie, or playing a game. Leveraging the platform’s support for GenAI capabilities, SHM will transform the cabin into a digital haven, offering personalized content and AI enabled interactive features that enhance the driving and passenger experience.
- Snapdragon® Auto Connectivity Platforms offer robust, security-rich connectivity for infotainment systems and precise positioning to enable secure vehicle connection, providing comprehensive access to entertainment, navigation, and other digital services.
- Snapdragon® Ride Platform provides AFEELA with an open and customizable solution for developing advanced driver assistance system (ADAS) features. This platform offers flexibility with low power and high throughput and a production-grade toolchain for AI integration and data handling. The Snapdragon Ride solution is designed with safety and advanced automation in mind, enabling the creation of sophisticated systems that offer a smooth, automated driving experience.
“Our collaboration with Sony Honda Mobility underscores our unwavering commitment to advancing automotive technology for next-generation vehicles,” said Nakul Duggal, group general manager, automotive, industrial, and loud, Qualcomm Technologies, Inc. “We are thrilled to strengthen our relationship by equipping upcoming AFEELA vehicles with cutting-edge technologies like GenAI, delivering premium, sophisticated, and safety-rich riding experiences that redefine the future of mobility.”
"By integrating Qualcomm Technologies’ Snapdragon Digital Chassis and GenAI into our AFEELA brand, we are taking a significant step towards realizing our vision of software-defined vehicles,” said Izumi Kawanishi, representative director, president, chief operating officer, Sony Honda Mobility. “This relationship allows us to offer our customers a seamless and connected driving experience, combining the best of automotive and digital innovation, and transforming the mobility space into an entertainment space.”
Suggested Items
Creation Technologies Celebrates Ribbon Cutting of Expanded Denver Product Realization Center
05/19/2025 | Creation TechnologiesCreation Technologies, an end-to-end, scalable Specialty Global Electronic Manufacturing Services provider, proudly celebrated the official ribbon-cutting ceremony of its newly expanded Denver Product Realization Center on Monday, May 12, 2025.
NY CREATES, Fraunhofer Institutes Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale
05/16/2025 | NY CREATESNY CREATES and Fraunhofer IPMS announced at a signing ceremony a new Joint Development Agreement (JDA) to drive research and development focused on memory devices.
DuPont Unveils Brand Identity for Qnity, Future Electronics Spin-Off
05/15/2025 | PRNewswireDuPont unveiled the branding of Qnity, the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business*.
SMC Korea 2025 to Spotlight Next-Generation Memory and Materials Innovation amid AI Boom
05/13/2025 | SEMIThe Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts and innovators to highlight the critical role of materials innovation in addressing the performance, efficiency, and scalability requirements of AI-enabled semiconductor devices.
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.