Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Navitas to Acquire Claros

08/27/2026 | Navitas
Navitas Semiconductor Corporation, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, announced the signing of a definitive agreement to acquire Claros, Inc. (Claros) a power management solutions company developing vertical power delivery (VPD) and integrated voltage regulator (IVR) technology for next-generation AI data centers, in a transaction valued at up to approximately $232.8 million, based on the per share closing price of Navitas’ stock on August 21, 2026.

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

08/27/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX Hall 1 and 2 in Taipei, Taiwan.

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

08/26/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton University’s Innovative Technologies Complex in New York.

Teledyne FLIR OEM Selected for U.S. Army DUTCH Award for Next-Gen Thermal Imaging

08/25/2026 | BUSINESS WIRE
Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, announced it was selected to support the U.S. Army’s Delivering Unmatched Thermal Capability Hastened (DUTCH) initiative, led by the Office of the Assistant Secretary of War for Critical Technologies and the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center, to enhance next-generation uncooled thermal infrared (IR) sensing for defense applications.

STMicroelectronics, NUS launch Corporate Lab to power the future of Edge AI in Singapore

08/24/2026 | Globe Newswire
HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in