-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
January 13, 2025 | U.S. Department of CommerceEstimated reading time: 2 minutes
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. This award will support the expansion and modernization of the existing facility of HP Inc. (“HP”) in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (R&D) activities to commercial manufacturing operations, and serves as one of three R&D Centers for Excellence within the company’s global footprint. The award comes after the previously signed preliminary memorandum of terms, announced on August 27, 2024, and the completion of the Department’s due diligence. The Department will disburse the funds based on HP’s completion of project milestones.
“Companies like HP are developing the technologies that will spur unprecedented breakthroughs for generations to come,” said U.S. Secretary of Commerce Gina Raimondo. “By investing in companies and R&D projects across the semiconductor ecosystem, the Biden-Harris administration is helping to build and secure the domestic semiconductor capabilities that will help the United States continue to out-compete and out-build the rest of the world.”
Among other products, the CHIPS funding would support the manufacturing of silicon devices that are key components of life sciences lab equipment, which are used in drug discovery, single-cell research, and cell line development. By leveraging HP’s expertise in microfluidics and microelectromechanical systems (MEMS), these devices allow for increased speed and precision during life sciences R&D. The project is estimated to create and sustain nearly 150 construction jobs and over 100 manufacturing jobs.
“From semiconductors to supercomputers, President Biden’s Investing in America agenda is ensuring that America continues to be a global leader for invention and entrepreneurship,” said White House Deputy Chief of Staff Natalie Quillian. “Today's announcement with HP will build on the company’s 86-year history driving American innovation and support U.S. competitiveness in the 21st century.”
“HP is pleased its CHIPS grant has been finalized, which will bolster semiconductor production and innovation in the United States. This significant development will accelerate our work and innovation in Micro-Electro-Mechanical Systems (MEMS) technology, which directly benefits the U.S. semiconductor and life sciences industries, as well as strengthens global competitiveness,” said Enrique Lores, President and CEO, HP.
As stated in the CHIPS Notice of Funding Opportunity for Commercial Fabrication Facilities, CHIPS for America will distribute direct funding to recipients for capital expenditures based on the completion of construction, production, and commercial milestones. The program will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions.
Suggested Items
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
01/09/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered in Durham, North Carolina.
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
01/07/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.
AI Server Market Will Keep Growing Through 2025, with Related Industry Value Projected to Reach $298B
01/06/2025 | TrendForceAccording to the latest research from TrendForce, the value of the entire server industry is estimated to total US$306 billion in 2024.