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Hot Off the Press: Explore the New Issue of IPC Community
January 14, 2025 | IPC Community Editorial TeamEstimated reading time: 1 minute

The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members.
What’s in this issue?
Tariff Troubles: What could a new U.S. administration’s tousle with tariffs mean for your business? IPC Chief Economist Shawn DuBravac lays out the scenario.
Student Leadership: Waad Tarman finishes up her term as the Student Board Member. Find out why the future of electronics is in good hands. (Bonus Video: Hear from two of IPC’s Emerging Engineers, who talk about their path into the industry.)
Women in Business: Barbara Pauls and Siti Wahab show that determination and ingenuity—and a belief in yourself—are enough to overcome any challenge. Get takeaways you can implement in your own pursuit of excellence.
Pure Gold: What would IPC be without its A-Teams? Join us as we go behind the scenes of the 2024 Golden Gnome Awards. You’ll meet the IPC tech team who puts this event all together, and find out what makes it so special.
Dynamic Duo: Brian Chislea of Dow and AJ Arriaga of Summit Interconnect embark on a journey of discovery and growth in IPC’s mentorship program.
Around the World: Read features on two of IPC Asia’s biggest trade shows, how China is developing future engineers, an India wire harness company making waves, IPC’s newest sustainability expert Diana Radovan, a review of electronica 2024, sustainability practices, apprenticeships, and so much more.
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Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).