Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Technica USA Showcases PCBA Supply Partners at IPC APEX EXPO 2025

03/13/2025 | Technica USA
Technica USA is thrilled to highlight its full portfolio of PCBA supply partners at the 2025 APEX/IPC Expo in Anaheim, California. Featuring some of the world’s leading suppliers, Technica’s PCBA product lineup continues to drive innovation and excellence in the industry.

Intel Appoints Lip-Bu Tan as Chief Executive Officer

03/13/2025 | Intel Corporation
Intel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.

TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

VIA Announces Strategic Collaboration with Solectrix

03/13/2025 | VIA optronics AG
VIA optronics AG, a leading supplier of interactive display solutions, today announced a new strategic collaboration with Solectrix GmbH, a full-service provider in the embedded electronics sector.

IMAPS and DPC: 21 Years of Elevating Technical Knowledge

03/13/2025 | Marcy LaRont, I-Connect007
The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in