Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
January 15, 2025 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%.
SEMI & ESDA“The electronic design automation (EDA) industry reported significant revenue growth in Q3 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering and Services posted double-digit growth, with Printed Circuit Board and Multi-Chip Module, and Semiconductor Intellectual Property also posting growth. Regionally, the Americas along with Europe, Middle East, and Africa reported double digit growth. The four-quarter moving average increased for all product categories and regions.”
The companies tracked in the EDMD report employed 62,417 people globally in Q3 2024, a 4.5% increase over the Q3 2023 headcount of 59,737, but down 1.2% compared to Q2 2024.
The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns.
Revenue by Product and Application Category – Q3 2024 Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue jumped 16% to $1,922.2 million in Q3 2024. The four-quarter CAE moving average increased 14.5%.
- Integrated Circuit (IC) Physical Design and Verification revenue decreased 5.5% to $854.4 million. The four-quarter moving average for the category increased 4.3%.
- Printed Circuit Board (PCB) and Multi-Chip Module (MCM) revenue rose 5.8% to $450.8 million. The four-quarter moving average for PCB and MCM rose 9.1%.
- Semiconductor Intellectual Property (SIP) revenue increased 7% to $1,686.2 million. The four-quarter SIP moving average rose 17.5%.
- Services revenue rose 45.2% to $200.8 million. The four-quarter Services moving average rose 30.8%.
Revenue by Region – Q3 2024 Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $2,325.4 million of electronic system design products and services in Q3 2024, a 17.2% increase. The four-quarter moving average for the Americas rose 17%.
- Europe, Middle East, and Africa (EMEA) procured $645.6 million of electronic system design products and services, a 17.1% increase. The four-quarter moving average for EMEA grew 15.4%.
- Japan’s procurement of electronic system design products and services decreased 3.5% to $298.5 million. The four-quarter moving average for Japan increased 7.6%.
- Asia Pacific (APAC) procured $1,845 million of electronic system design products and services, an 0.7% decrease. The four-quarter moving average for APAC grew 10.6%.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).