-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
NAMICS Brings Innovative Thermoset Materials to PCB Fabrication
January 16, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below. With its ability to integrate seamlessly into existing processes and equipment, this promises to meet the evolving needs of fabricators, particularly in UHDI and high-frequency products.
Andy Shaughnessy: Matt and Ken, you have a material that's actually been used in the packaging world for quite some time, but you are now introducing it into PCB fabrication. Is this addressing a long-time need?
Matt Lake: I've been in this industry for the better part of 42 years as either a laminate or board manufacturer. At least once a month, a board supplier has said to me, “Can you supply us with your resin simply cast onto a film for applications where we need to fill heavy coppers not necessarily for via fill?”
NAMICS has been making this material for a long time but for a different industry. Traditionally, films that are thermoplastics just don’t work well in these applications. The NAMICS product is a thermoset material. The range of thicknesses fits perfectly into the PCB market. It's been very well received, and enough to keep me from fully retiring.
Shaughnessy: Ken, what are the specifics of this thermoset material, and how was it originally developed for the semiconductor packaging industry?
Ken Araujo: We developed this film called ADFLEMA (Advanced Flexible Materials) well over 15 years ago. The idea was to develop a very low-loss A-stage thermoset film that can be used in developing build-up layers in advanced packaging, commonly on the wafer level.
To continue reading this interview, which originally published in the December 2024 issue of PCB007 Magazine, click here.
Suggested Items
Fujifilm to Invest 4 Billion yen in Belgium for CMP Slurries and Photolithography-related Materials
02/07/2025 | FujifilmFUJIFILM Corporation today announced that it will install new production facilities of CMP slurries*1, advanced semiconductor materials, and enhance existing facilities for photolithography-related materials*2 at its production site located in Belgium. In Europe, where demand for automotive semiconductors and industrial semiconductors supporting the DX of manufacturing processes at factories is expected to grow, Fujifilm makes an investment of approximately 4 billion yen (approx. 25 million EUR) to expand the production capacity of its Belgium site, based in Zwijndrecht, Antwerp.
Indium Expert to Address Thermal Challenges at TestConX 2025
02/04/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.
02/04/2025 | PR Newswire3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
The Future of Electronics Manufacturing in APAC
01/30/2025 | Daniel Schmidt, MKS' ATOTECHThe Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.