-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
NAMICS Brings Innovative Thermoset Materials to PCB Fabrication
January 16, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below. With its ability to integrate seamlessly into existing processes and equipment, this promises to meet the evolving needs of fabricators, particularly in UHDI and high-frequency products.
Andy Shaughnessy: Matt and Ken, you have a material that's actually been used in the packaging world for quite some time, but you are now introducing it into PCB fabrication. Is this addressing a long-time need?
Matt Lake: I've been in this industry for the better part of 42 years as either a laminate or board manufacturer. At least once a month, a board supplier has said to me, “Can you supply us with your resin simply cast onto a film for applications where we need to fill heavy coppers not necessarily for via fill?”
NAMICS has been making this material for a long time but for a different industry. Traditionally, films that are thermoplastics just don’t work well in these applications. The NAMICS product is a thermoset material. The range of thicknesses fits perfectly into the PCB market. It's been very well received, and enough to keep me from fully retiring.
Shaughnessy: Ken, what are the specifics of this thermoset material, and how was it originally developed for the semiconductor packaging industry?
Ken Araujo: We developed this film called ADFLEMA (Advanced Flexible Materials) well over 15 years ago. The idea was to develop a very low-loss A-stage thermoset film that can be used in developing build-up layers in advanced packaging, commonly on the wafer level.
To continue reading this interview, which originally published in the December 2024 issue of PCB007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.