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Infineon Strengthens Supply Chain with New Backend Fab in Thailand

01/16/2025 | Infineon
Infineon Technologies AG has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint. After an official meeting with the Prime Minister of Thailand, Paetongtarn Shinawatra, at the Government House, Infineon's Chief Operations Officer Dr. Rutger Wijburg launched the construction of the new fab today.

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

01/16/2025 | U.S. Department of Commerce
The U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.

SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips

01/15/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden Administration’s decision to publish an interim final rule titled, “Export Control Framework for Artificial Intelligence Diffusion.”

SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth

01/14/2025 | SEMI
Industry Strategy Symposium (ISS) 2025 sessions open gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem

01/13/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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