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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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AI Infrastructure to Dominate MLCC Demand in 2025 amid Persistent Oversupply Challenges
January 16, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest investigations have revealed the U.S. economy outperformed market expectations in December 2024, with non-farm payrolls and the Manufacturing Purchasing Managers’ Index (PMI) delivering strong results. Consequently, the Federal Reserve may significantly scale back the frequency of rate cuts in 2025, prolonging a high-interest-rate environment. This scenario could dampen consumer spending and undermine corporate confidence in investment and expansion. TrendForce estimates that MLCC shipments will reach 1,146.7 billion units in 1Q25, marking a 3% QoQ decline.
Anticipation of Trump’s tax policies, growing GB200 orders, and Lunar New Year stockpiling fuel early-year inventory surge
TrendForce reports that major laptop brands such as Dell and HP have accelerated orders for educational laptop contracts awarded in the second half of 2024 to mitigate potential tariffs anticipated under President Trump’s administration starting January 2025. ODMs like Compal, Quanta, and Inventec have been asked to deliver shipments before January 20, boosting MLCC supplier demand early in the year.
Additionally, growing GB200 orders managed by Foxconn, Quanta, and Wistron, coupled with stockpiling ahead of the Lunar New Year in late January, have further driven a surge in early 2025 MLCC shipments.
Despite this initial momentum, MLCC suppliers remain cautious. The expedited North American shipments may weaken Q2 demand for educational laptops, while potential trade restrictions and tariffs under the new administration could disrupt OEM and ODM production and shipping plans. These factors might also raise upstream supply chain costs and introduce uncertainty around production base relocations.
Slowing growth in consumer electronics: Demand for AI infrastructure stands out
Looking ahead to 2025, AI infrastructure—including servers, accelerators, and power management systems—will remain the primary driver of MLCC demand. Growth across other ICT industries, such as smartphones and notebooks, is expected to remain tepid, with average growth rates projected at under 10%.
TrendForce notes that MLCC suppliers are unlikely to achieve full capacity utilization this year due to persistent oversupply in the market. The ongoing challenge for the industry will be balancing pricing and order volumes—a critical test for navigating 2025.
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July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.