I-Connect007 Editor's Choice: Five Must-Reads for the Week
January 17, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Ah, January! The season of new beginnings, new goals, and the annual company meeting, where all the initiatives and objectives that survived the end-of-year planning and budgeting process are launched. Such as the case for our IPC team this week as we gathered in Chicago for some games, some inspiration, and, most definitely, some goal setting.
We’re even more committed to being your best source for industry news and tips and tricks of the trade. To that end, I’m sharing my favorite news items of the week. They range from reports on quarterly earnings to Dan Feinberg’s coverage of CES and some harsh reality from marketing expert Dan Beaulieu. If you missed it on Monday, be sure to read it again here. It’s well worth your time.
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
January 15
System design continues to move to the forefront of all the design methodologies. No longer can we design in “silos of discipline,” but human collaboration and design data sharing continue to integrate. The ESD Alliance, a SEMI Technology Community tracking this space, announced in its latest Electronic Design Market Data (EDMD) report that, among the data included, the four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%. This is a good read for those who follow the design tools market.
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
January 14
Dan Feinberg, our resident expert on CES, reports in with his review of the show’s most significant announcements. In these announcements, the industry’s biggest players showcase their key strategic objectives for 2025, inevitably with a trickle-down effect on PCB manufacturing. Dan’s coverage of CES is not to be missed.
Global PCB Connections: The Future of HDI PCBs
January 16
In this column this month, Jerome Larez takes a long look at high density interconnect (HDI). While HDI techniques have been available for quite some time, HDI is steadily moving down the adoption curve from “bleeding edge” to “early and late majority” status. HDI is increasingly a requirement for our customers. Whatever your role in electronics manufacturing, you can benefit from understanding what HDI entails. Give Jerome’s column a read; he does a good job making it clear.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
January 10
Responding to the combination of factors of increased vehicle safety and more immersive rider experiences, Texas Instruments have developed a new line of sensors and electronics components for the automotive market. As stated in the press release, the demand for added capability and value is up and down the vehicle portfolio, from luxury to economy models. Read more here.
It’s Only Common Sense It’s Not the Market’s Fault—Take Responsibility for Your Business
January 13
Long-time columnist Dan Beaulieu pulls no punches in this column, launching with this: “Stop blaming the market and start looking in the mirror. Success doesn’t happen by chance; failure isn’t simply bad luck. It’s about owning your decisions, adapting to change, and focusing on what you can control. If you want to survive and thrive, it’s time to take responsibility for your business.”
Now that we’ve all had our planning sessions and our annual kickoff meetings, check your progress against the points Dan makes in his column.
Suggested Items
CCL Design, Ynvisible Announce Strategic Partnership to Deliver Scalable Printed Display Solutions
04/28/2025 | CCL DesignCCL Design will integrate Ynvisible's proprietary display technology into its global manufacturing infrastructure and technology portfolio.
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
04/24/2025 |Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?